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Temperature / Pressure Sensing Array(TPSA)

 

Ming-Yuan Cheng, Wei-Yao, Chang, Sheng-An Yang, and Xin-Hua Huang

    
    This paper presents the design, fabrication and measurement of a flexible 8x8 temperature and tactile sensing array which will be used as the artificial skin for robot applications. The temperature and tactile sensing elements are heterogeneously integrated on a flexible copper-PI film using micromachining techniques. The tactile sensing elements are formed by dispensing conductive polymer on the pre-defined interdigital copper electrodes. This novel fabrication method can effectively reduce the crosstalk between each sensing element.  The strategy and the verification for reducing crosstalk currents are described.  The mechanical and electrical properties of tactile sensing elements are measured.  Also, discrete temperature sensor chips are employed as the temperature sensing cells. Scanning circuits are implemented.  Finally, measured temperature and tactile images have been successfully obtained by using the integrated 8×8 sensing arrays.  The flexible sensor arrays are bendable down to a 4-mm radius without any degradation in functionality.


   


 Figure 1. The schematic of the artificial skin proposed in this work.


Figure 2. The fabricated 8x8 temperature / pressure sensing arrays.


Figure 3. The fabricated 32x32 temperature / pressure sensing arrays.

 

Figure 4. The measured temperature and pressure distributions of a human right hand.




Publications:

1.  Y.-J. Yang, M.-Y. Cheng, W.-Y. Chang, L.-C. Tsao, S.-A. Yang, W.-P. Shih, F.-Y. Chang, S.-H. Chang, and K.-C. Fan, "An integrated flexible temperature and tactile sensing array using PI-copper films," Sensors and Actuators A-Physical, vol. 1
43, pp. 143-153, 2008. (SCI/EI)

2. Y.-J. Yang, M.-Y. Cheng, S.-C. Shih, X.-H. Huang, C.-M. Tsao, F.-Y. Chang, and K.-C. Fan, “A
32×32 temperature and tactile sensing array using PI-copper films”, International Journal of Advanced Manufacturing Technology, 2009. (SCI/EI)

 

 
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