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Figure 1. (a) The schematic of the capacitive sensing array proposed in this work. (b) The exploded drawing of the sensing array.
Figure 2. The detailed illustration and dimensions of the proposed tactile sensing element. This figure is not to scale.
Figure 3. (a) The fabricated PDMS bump layer. (b) The fabricated PDMS structure layer. (c) The FPCB layer. (d) The fabricated flexible 8x8 tactile sensing array.
Publications:
1. M-Y Cheng, X-H Huang, C-W Ma and Y-J Yang "A flexible capacitive tactile sensing array with floating electrodes," Journal of Micromechanics and Microengineering, vol. 19, pp. 1-10, 2009. (SCI/EI)
2.M.-Y. Cheng, B.-T. Liao, X.-H. Huang and Y.-J. Yang, “A flexible tactile sensing array based on novel capacitance mechanism,” 15th International Conference on Solid-State Sensors, Actuators and Microsystems Conference, 2009 (Transducers' 09), pp. 2182-2185, 2009. (Oral presentation)
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