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1. Personal data
Place of Birth: Tainan, Taiwan.
Phone：(+886)-2-33664941-17
2. Education
M.S. Department of Mechanical Engineering, National Cheng Kung University, Taiwan, 2002.
B.S. Department of Mechanical Engineering, National Yunlin University of Science & Technology, Taiwan, 2000.
3. Current position and relevant experience
12/2004 - 03/2006, Term of enlistment.
09/2002 - 05/2009, Ph.D. student, Department of Mechanical Engineering, National Taiwan University.
06/2009 - , Post-Doctoral, Department of Mechanical Engineering, National Taiwan University.
4. Fields of specialty (limit to fields related to research)
Microelectromechanical systems, Flexible tactile sensing array
5. Publications (selective papers from 2006-2009)
Journal Papers
1. J. J. J. Wang and M.-Y. Cheng, "On the machining characteristics of H13 tool steel in different hardness states in ball end milling," International Journal of Advanced Manufacturing Technology, vol. 22, pp. 855-863, Dec 2003.
2. Y.-J. Yang, M.-Y. Cheng, W.-Y. Chang, L.-C. Tsao, S.-A. Yang, W.-P. Shih, F.-Y. Chang, S.-H. Chang, and K.-C. Fan, "An integrated flexible temperature and tactile sensing array using PI-copper films," Sensors and Actuators A-Physical, vol. 143, pp. 143-153, 2008.
3. Y.-J. Yang, M.-Y. Cheng, S.-C. Shih, X.-H. Huang, C.-M. Tsao, F.-Y. Chang, K.-C. Fan, “A 32×32 temperature and tactile sensing array using PI-copper films”, International Journal of Advanced Manufacturing Technology, 2009.
4. M.-Y. Cheng, X.-H. Huang and Y.-J. Yang, “A flexible capacitive tactile sensing array with floating electrodes,” Journal of Micromechanics and Microengineering, (Accepted, Article ID: JMM/315480/PAP).
5. M.-Y. Cheng, C.-M. Tsao, Y.-Z. Lai and Y.-J. Yang, “The development of a highly twistable tactile sensing array with stretchable helical electrodes,” Sensors and Actuators A: Physical, (Submitted, Article ID: SNA-S-09-00368).
Conference Papers
1. M.-Y. Cheng, B.-T. Liao, X.-H. Huang and Y.-J. Yang, “A flexible tactile sensing array based on novel capacitance mechanism,” 15th International Conference on Solid-State Sensors, Actuators and Microsystems Conference, 2009 (Transducers' 09), 2009. (Oral presentation)
2. M.-Y. Cheng, C.-M. Tsao and Y.-J. Yang, “A novel highly-twistable tactile sensing array using extendable spiral electrodes,” 22nd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2009), pp.92-95, 2009. (Oral presentation)
4. Y.-J. Yang, M.-Y. Cheng, C.-L. Lin, C.-M. Tsao, S.-A. Yang, W.-P. Shih, F.-Y. Chang, and K.-C. Fan, “A wireless flexible temperature and tactile sensing array for robot applications,” International Symposium on Precision Mechanical Measurements(ISPMM’2008), 2008.
5. L.-C. Tsao, M.-Y. Cheng, I.-L. Chen, W.-P. Shih, Y.-J. Yang, F.-Y. Chang, K.-C. Fan, and S.-H. Chang, “Flexible temperature sensor array using electro-resistive polymer for humanoid artificial skin,” 14th International Conference on Solid-State Sensors, Actuators and Microsystems Conference, 2007 (Transducers' 07), pp. 2287-2290, 2007.
6. Y.-J. Yang, M.-Y. Cheng, W.-Y. Chang, L.-C. Tsao, S.-A. Yang, W.-P. Shih, F.-Y. Chang, S.-H. Chang, and K.-C. Fan, “A large area temperature and tactile sensing array”, International Symposium on Measurement Technology and Intelligent Instruments (ISMTII 2007), 2007.
7. M.-Y. Cheng, W.-Y. Chang, L.-C. Tsao, S.-A. Yang, Y.-J. Yang, W.-P. Shih, F.-Y. Chang, S.-H. Chang, and K.-C. Fan, “Design and fabrication of an artificial skin using PI-copper films”, 20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007), pp. 389-392, 2007.
8. M.-Y. Cheng, W.-Y. Chang, L.-C. Tsao, S.-A. Yang, Y.-J. Yang, W.-P. Shih, F.-Y. Chang, and K.-C. Fan, “Integrated temperature and tactile sensing arrays on a flexible substrate”, International Manufacturing Leaders Forum (IMLF 2006), 2006. (Oral presentation)
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